Engine category

PCB and Transmission Lines

Published tools in this category solve distinct design decisions. Each keeps its assumptions, limits, and next decision visible.

Standard approximation

Microstrip impedance estimator

Estimate outer-layer single-ended microstrip impedance from trace width, dielectric height, and relative permittivity.

Standard approximation

Stripline impedance estimator

Estimate symmetric stripline single-ended impedance from plane distances, trace width, thickness, and dielectric constant.

Standard approximation

Differential stripline impedance

Estimate embedded differential stripline pair impedance from single-ended impedance and the spacing-to-height ratio.

Exact ideal relationship

Differential-pair skew planner

Convert a routing timing-skew budget into an allowable length mismatch using one propagation-delay value.

Standard approximation

PCB via resistance and drop

Estimate plated via barrel DC resistance from finished hole diameter, plating thickness, and via length.

Standard approximation

PCB via inductance estimator

Estimate via loop inductance from via length, radius, and distance to the modeled return path.

Exact ideal relationship

Power-plane capacitance

Calculate ideal parallel-plate capacitance for a power-ground plane pair from area, separation, and dielectric constant.

Exact ideal relationship

PDN target-impedance planner

Calculate a flat power-distribution-network target impedance from allowed voltage ripple and a load current step.

Standard approximation

PCB crosstalk estimator

Estimate a relative near/far-end coupling index from trace spacing and parallel-run length.

Standard approximation

Source-termination designer

Calculate a first-pass series source-termination resistor from line impedance and driver output resistance.

Exact ideal relationship

Stub resonance and length limit

Calculate stub one-way delay and quarter-wave resonant frequency from propagation velocity and stub length.

Standard approximation

PCB thermal-via planner

Estimate ideal parallel thermal conductance of a plated thermal-via array from geometry and copper thermal conductivity.